Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)

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Bloomberg:
Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks  —  ASML Holding NV has won commitments from top chipmakers to use its latest semiconductor production gear, while embarking …

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